DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation
In arXiv preprint, 2026
DICE introduces detailed, end-to-end physical-layer modeling for inter-chiplet links, capturing signal integrity, forward error correction, channel noise, retransmission, and the resulting architectural effects.
Links: arXiv, GitHub repository.
Recommended citation: R. Aligholipour, S. Kaxiras and Yuan Yao, "DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation," arXiv:2607.24221, 2026.
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